Next-generation vehicles are no longer defined by mechanical systems alone. They are defined by silicon, software, and the ability to integrate complex compute platforms into production-grade automotive architectures. At NVIDIA GTC 2026, we will exhibit our solution to the semiconductor industry.
As vehicle compute platforms continue to increase in capability, the complexity of integration has grown just as rapidly. In automotive programs, bringing a custom MCU or SoC into production involves far more than achieving strong benchmark performance.
Successful deployment requires coordinated work across BSP development, RTOS integration, middleware stability, functional safety alignment, system validation under real-world load, and strict adherence to OEM program timelines. Each layer must behave predictably under automotive constraints such as thermal variation, long lifecycle support, cybersecurity requirements, and ISO 26262 compliance.
For semiconductor companies, the ability to support downstream integration into vehicle architectures has become a decisive factor in design wins. OEMs and Tier 1 suppliers increasingly evaluate not only compute capability, but also integration maturity, reference software quality, and the availability of engineering support throughout the program lifecycle.
This is particularly visible in platforms associated with high-performance automotive compute, including advanced driver assistance systems, in-vehicle AI workloads, centralized vehicle architectures, and next-generation domain controllers. Regardless of architecture, the core challenge remains consistent: translating silicon capability into reliable, production-ready vehicle systems.
NVIDIA GTC brings together many of the teams working at this intersection of automotive and accelerated compute. If you are attending and involved in automotive chip integration, validation, or software platform development, we look forward to connecting in person.
Robert Laukas and Calle Unnérus from our team will be on-site in San Jose, California, March 16–19.
